| PART |
Description |
Maker |
| 85013-3093 0850133093 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284106 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90147-1109 0901471109 |
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 9 Circuits
2.54mm (.100) Pitch C-Grid垄莽 PC Board Connector, Single Row, Vertical, 9 Circuits
|
Molex Electronics Ltd.
|
| 90147-1112 0901471112 |
2.54mm (.100) Pitch C-Grid庐 PC Board Connector, Single Row, Vertical, 12 Circuits
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 12 Circuits
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0015910140 015-91-0140 A713080114N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910540 015-91-0540 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
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